Brief: Discover the advanced BGA Pitch 0.3mm HDI PCB Board, a high-density interconnect solution perfect for consumer electronics. With customizable features like a min. core thickness of 0.05mm and blind hole aspect ratio of 1:1, this PCB prototype board ensures precision and reliability for your high-tech devices.
Related Product Features:
BGA Pitch of 0.3mm ensures high precision and accuracy in component placement.
Min. core thickness of 0.05mm enhances durability and reliability.
Max. board size of 540*620mm accommodates a wide range of consumer electronics.
Min. line width/space of 0.04mm allows for complex circuitry and smaller components.
Misalignment tolerance of +/- 0.06mm ensures precise layer alignment.
Vias aspect ratio of 16:1 supports high-density interconnect technology.
Min. mechanical drill hole size of 0.1mm for intricate designs.
Board thickness range of 0.2-3.2mm suits various application needs.
자주 묻는 질문:
What is the BGA pitch of the HDI PCB Board?
The BGA pitch of the HDI PCB Board is 0.3mm, ensuring high precision in component placement.
What is the minimum core thickness of the HDI PCB Board?
The minimum core thickness of the HDI PCB Board is 0.05mm, providing enhanced durability and reliability.
What industries can benefit from using the HDI PCB Board?
The HDI PCB Board is ideal for consumer electronics, aerospace, medical equipment, telecommunications, and automotive industries due to its high-density interconnect technology and reliability.